Photo by BCM SENSOR TECHNOLOGIES b.v.b.a
BCM SENSOR has recently released a newly developed flip-chip pressure sensor die for mass production. This flip-chip sensor die, model SE105, is based on piezoresistive working principle and is manufactured by 6” silicon micro-machining process.
Thanks to the flip-chip structure which has been realized at the SE105 pressure sensor die via MEMS manufacturing process, the flip-chip pressure sensor die SE105 possesses the following advantages comparing to the conventional-structure of pressure sensor dies:
The SE105 flip-chip pressure sensor die also features an outstanding non-linearity of 0.2%fs and an excellent long-term stability of 0.1%fs/year.
For more information, please visit http://bcmsensor.com.